Analytical Services

Surface Analysis

  • X-Ray Photoelectron Spectroscopy (XPS, ESCA)
    Typical XPS projects include surface segregation, corrosion, semiconductor & electrical contact contamination, surface cleanliness, paint & coating delamination, and intergranular fracture.
  • Auger Electron Spectroscopy (AES)
    Material issues analyzed with Auger include surface & grain boundary segregation, surface cleanliness, corrosion, semiconductor and electrical contact contamination, and small area analysis.
  • Additional techniques
    Atomic force microscopy (AFM)
    Surface energy & contact angle determination
    Surface roughness
    Coating adhesion testing
    Nanohardness

Microscopy & Diffraction

Organic Material Analysis

Bulk Chemistry

  • Inductively coupled plasma (ICP) with optical emission or mass spectrometry
  • Atomic absorption
  • Spark emission for alloy identification
  • Trace metals analysis

Comparison of Analysis Methods