- X-Ray Photoelectron Spectroscopy (XPS, ESCA)
Typical XPS projects include surface segregation, corrosion, semiconductor & electrical contact contamination, surface cleanliness, paint & coating delamination, and intergranular fracture.
- Auger Electron Spectroscopy (AES)
Material issues analyzed with Auger include surface & grain boundary segregation, surface cleanliness, corrosion, semiconductor and electrical contact contamination, and small area analysis.
- Time-of-Flight Secondary Ion Mass Spectrometry (Static) (TOF-SIMS)
Generally used for very specific organic material identification, TOF-SIMS studies include polymer curing & surface segregation, surface cleanliness and silicone analysis.
- Dynamic Secondary Ion Mass Spectrometry (D-SIMS)
Dynamic secondary ion mass spectrometry (D-SIMS) is used to quantitatively determine changes in composition as a function of depth of inorganic materials.
- Additional techniques
Atomic force microscopy (AFM)
Surface energy & contact angle determination
Coating adhesion testing
Microscopy & Diffraction
- Scanning Electron Microscopy/Energy Dispersive Spectroscopy (SEM/EDS)
Often the first screening technique to examine a wide range of materials
- X-Ray Diffraction (XRD)
Identify crystalline compounds, including crystallinity of polymers
- Electron Backscatter Diffraction (EBSD)
Determine the fraction of specific phases within a microstructure
- Optical Microscopy & Sample Preparation
Complete sample preparation facilities
Organic Material Analysis
- Fourier Transform Infrared Analysis (FTIR)
- Gas Chromatography/Mass Spectrometry (GC/MS)
- Thermal Gravimetric Analysis (TGA)
- Differential Scanning Calorimetry (DSC)
- Melt Flow Index (MFI)
- Mechanical Property Testing
- Reverse Engineering
- Inductively coupled plasma (ICP) with optical emission or mass spectrometry
- Atomic absorption
- Spark emission for alloy identification
- Trace metals analysis