X-Ray Photoelectron
Spectroscopy
(XPS, ESCA)

Typical XPS projects include surface segregation, corrosion, semiconductor & electrical contact contamination, surface cleanliness, paint & coating delamination, and intergranular fracture.

 

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Auger Electron
Spectroscopy
(AES)

Material issues analyzed with Auger include surface & grain boundary segregation, surface cleanliness, corrosion, semiconductor and electrical contact contamination, and small area analysis.

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Time-of-Flight Secondary Ion Mass Spectrometry (Static)
(TOF-SIMS)

Generally used for very specific organic material identification, TOF-SIMS studies include polymer curing and surface segregation, surface cleanliness and silicone analysis.

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Additional
Techniques

Dynamic Secondary Ion Mass Spectrometry (D-SIMS)
Atomic force microscopy (AFM)
Surface energy & contact angle
Surface roughness
Coating adhesion testing
Nanohardness

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