X-Ray Photoelectron
Spectroscopy
(XPS, ESCA)
Typical XPS projects include surface segregation, corrosion, semiconductor & electrical contact contamination, surface cleanliness, paint & coating delamination, and intergranular fracture.
Auger Electron
Spectroscopy
(AES)
Material issues analyzed with Auger include surface & grain boundary segregation, surface cleanliness, corrosion, semiconductor and electrical contact contamination, and small area analysis.
Time-of-Flight Secondary Ion Mass Spectrometry (Static)
(TOF-SIMS)
Generally used for very specific organic material identification, TOF-SIMS studies include polymer curing and surface segregation, surface cleanliness and silicone analysis.
Additional
Techniques
Dynamic Secondary Ion Mass Spectrometry (D-SIMS)
Atomic force microscopy (AFM)
Surface energy & contact angle
Surface roughness
Coating adhesion testing
Nanohardness