Typical XPS projects include surface segregation, corrosion, semiconductor & electrical contact contamination, surface cleanliness, paint & coating delamination, and intergranular fracture.
Material issues analyzed with Auger include surface & grain boundary segregation, surface cleanliness, corrosion, semiconductor and electrical contact contamination, and small area analysis.
Generally used for very specific organic material identification, TOF-SIMS studies include polymer curing & surface segregation, surface cleanliness and silicone analysis.
Dynamic secondary ion mass spectrometry (D-SIMS) is used to quantitatively determine changes in composition as a function of depth of inorganic materials.
Atomic force microscopy (AFM)
Surface energy & contact angle determination
Coating adhesion testing